Functional Bonding Sheet
Bonding sheet with excellent insulation and bonding properties. We offer a variety of products for multilayer FPC substrate applications, high-speed transmission, Stiffener adhesion, electronic component adhesion, and other applications.
SA-series
Coverlay Film
Polyimide film coated with thermosetting adhesive. We have a wide variety of products for smartphones, notebook PCs, cameras, LCDs, and HDDs. Heat-resistant applications for automotive use and ultra-thin types for consumer use are also available.
C-series
Copper Clad Laminate
Polyimide film and copper foil are laminated with a thermosetting adhesive.
We have a wide range of materials with specialized characteristics for PC, automotive, and semiconductor equipment applications, and we have a proven track record in a wide variety of fields.
We have a wide range of materials with specialized characteristics for PC, automotive, and semiconductor equipment applications, and we have a proven track record in a wide variety of fields.
F-series
BS | Halogen-free | Features & Applications | Documentation |
---|---|---|---|
F-30V | – | General purpose, high adhesion | |
F-50V | – | General purpose, excellent insulation reliability |
Stiffener Film
Composite polyimide film laminated with heat-resistant adhesive.
BS | Halogen-free | Features & Applications | Documentation |
---|---|---|---|
SNR | – | High adhesion, thick PI film | |
SNRU | – | Highly adhesive, thick PI film with thermal conductivity |
Stretchable Sheet
Film with adjusted elasticity, insulation, heat resistance, and moisture permeability. Proven track record in medical and healthcare applications for sensors.
ST-series
BS | Halogen-free | Features & Applications | Documentation |
---|---|---|---|
ST RB | 〇 | High moisture permeability, low elasticity | |
ST-@D | 〇 | Low moisture permeability, improved heat resistance |