FPC Materials

Functional Bonding Sheet

Bonding sheet with excellent insulation and bonding properties. We offer a variety of products for multilayer FPC substrate applications, high-speed transmission, Stiffener adhesion, electronic component adhesion, and other applications.

SA-series

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SA FV–High bonding strength, stiffener applications
SA FW〇High bonding strength, adhesion to metal plates, water resistance, stiffener applications
SA FG〇High heat resistance, long-term reliability, multilayer board applications
SA FP〇High heat resistance, excellent insulation reliability, multilayer applications, long-term reliability
SA FN〇High bonding strength, adhesion to metal sheets, metal sheets, stiffener applications
SA FU〇High heat dissipation, long-term heat resistance, adhesion to metal plates, stiffener applications
SA FY〇Low transmission loss material Low dielectric (2.6) and low dissipation factor (0.005) at 10GHz
SA FR-X3〇Ultra-low transmission loss material Low dielectric (2.4) and low dissipation factor (0.002) at 10GHz
SA FS〇High transparency, low temperature adhesion possible (from 70°C)

Coverlay Film

Polyimide film coated with thermosetting adhesive. We have a wide variety of products for smartphones, notebook PCs, cameras, LCDs, and HDDs. Heat-resistant applications for automotive use and ultra-thin types for consumer use are also available.

C-series

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C ISV–General purpose, high adhesion
C ISA–General purpose, excellent insulation reliability
C ISG〇High heat resistance, long-term reliability, and excellent insulation reliability
C NSY〇Low transmission loss material Adhesive layer Low dielectric (2.6), low dissipation factor (0.005) at 10GHz
Transparent Coverlay〇High transparency, low temperature adhesion possible (from 70°C)

Copper Clad Laminate

Polyimide film and copper foil are laminated with a thermosetting adhesive.
We have a wide range of materials with specialized characteristics for PC, automotive, and semiconductor equipment applications, and we have a proven track record in a wide variety of fields.

F-series

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F-30V–General purpose, high adhesion
F-50V–General purpose, excellent insulation reliability

Stiffener Film

Composite polyimide film laminated with heat-resistant adhesive.

BSHalogen-freeFeatures & ApplicationsDocumentation
SNR–High adhesion, thick PI film
SNRU–Highly adhesive, thick PI film with thermal conductivity

Stretchable Sheet

Film with adjusted elasticity, insulation, heat resistance, and moisture permeability. Proven track record in medical and healthcare applications for sensors.

ST-series

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ST RB〇High moisture permeability, low elasticity
ST-＠D〇Low moisture permeability, improved heat resistance
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