Copper Clad Laminate
Copper clad laminates are made of glass substrate and resin. We have a diverse lineup of single-sided, double-sided, thick plate, thick copper, etc., which can be used in different ways depending on the application.
| Type | UL/ANSI | Halogen-free | Features | Documentation |
|---|
| L-6504C | FR-4.0 | – | Standard Glass Cloth Substrates | |
| L-6554C | FR-4.0 | – | Tracking resistance (CTI value 600V compatible), low thermal expansion substrates | |
| L-6705C | FR-4.1 | 〇 | High Tg, high heat resistance, tracking resistance (CTI value 600V compatible) | |
| L-6524C | CEM-3.0 | – | Standard glass cloth + glass non-woven substrate | |
L-6524
T600C | CEM-3.0 | – | Tracking-resistant (CTI value 600V compatible) | |
Multilayer PCB Materials
Based on prepreg manufacturing technology and lamination technology accumulated over many years, this PCB material pursues “ease of use”.
| Type | UL/ANSI | Halogen-free | Features | Documentation |
|---|
| L-6504C | FR-4.0 | – | Standard Glass Cloth Substrates | |
| L-6554C | FR-4.0 | – | Tracking resistance (CTI value 600V compatible), low thermal expansion | |
| L-6705C | FR-4.1 | 〇 | High Tg, high heat resistance, tracking resistance (CTI value 600V compatible) | |
Unclad Laminate
A laminate without copper foil on the surface. We have a lineup that emphasizes workability. They are used for various reinforcing plates, transport jigs, module parts, etc.
| Type | UL/ANSI | Halogen-free | Features | Documentation |
|---|
| L-6504 | FR-4.0 | – | General-purpose FR-4.0, good dimensional stability | |
| L-6505 | – | 〇 | FR-4.1 type | |
| L-6705 | FR-4.1 | 〇 | High Tg, high heat resistance, tracking resistance (CTI value 600V compatible) | |
| L-6529 | CEM-3.0 | – | Glass cloth + glass non-woven fabric base material, good punching processability | |
| L-6527 | – | 〇 | CEM-3.1 type, good punching processability | |
| L-6535 | – | 〇 | Glass nonwoven fabric base material, low dust generation, good punching processability | |
